By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling strategy is confronted with remarkable demanding situations in basic and fiscal limits. Wafer point 3D IC can take numerous varieties, they usually frequently contain a stack of a number of thinned IC layers which are vertically bonded and interconnected via via silicon through TSV.
There is an extended string of advantages that you'll be able to derive from 3D IC implementation corresponding to shape issue, density multiplication, more suitable hold up and tool, greater bandwidth, and heterogeneous integration. This booklet provides contributions through key researchers during this box, protecting motivations, know-how systems, purposes, and different layout concerns.
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